Heat Shrinkable Compound Double Wall Pipe
Heat shrinkable compound double wall pipe made of heat shrinkable insulation material and heat shrinkable semiconductive material by the way of special processing technology.Inner layer show good insulation performance,outer layer is of semi-conductive,inner and outer layers are clung closely,shielded reliably．
|
Content |
Measurement methods |
Index |
|
Hardness (Shore A ) |
|
≤90 |
|
Tensile strength(Mpa) |
GB/T1040 |
≥12 |
|
Crack elongation (%) |
GB/T1040 |
≥300 |
|
120℃x168h Heat aging |
|
K1＞0.8, K2＞0.7 |
|
Volume resistivity(Ω.cm) |
GB/T1040 |
≥1x1014 |
|
Water-absorbing rate (%) |
ASTM D570 |
≤0.5 |
|
Content |
Measurement methods |
Index |
|
Hardness (Shore A ) |
|
≤90 |
|
Tensile strength(Mpa) |
GB/T1040 |
≥14 |
|
Crack elongation (%) |
GB/T1040 |
≥300 |
|
120℃x168h Heat aging |
|
K1＞0.8, K2＞0.7 |
|
Volume resistivity(Ω.cm) |
GB/T1040 |
50～100 |
|
Type and specification |
Internal diameter
before shrinking(mm)
|
Internal diameter
after shrinking (mm)
|
Toal wall thickness |
Length |
|
HDFH 30/11 |
≥30 |
≤1 |
4.5 |
300～1200 |
|
HDFH 35/13 |
≥35 |
≤13 |
4.5 |
300～1200 |
|
HDFH 45/16 |
≥45 |
≤16 |
4.5 |
300～1200 |
|
HDFH 55/20 |
≥55 |
≤20 |
4.5 |
300～1200 |
|
HDFH 65/25 |
≥65 |
≤25 |
4.5 |
300～1200 |
|
HDFH 88/30 |
≥85 |
≤30 |
5 |
300～1200 |
|
HDFH 100/38 |
≥100 |
≤38 |
5 |
300～1200 |
|
HDFH 120/45 |
≥120 |
≤45 |
5 |
300～1200 |
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HD-4 Series Double-Wall Heat Shrinkable Bushing
HD-4 series is a semi-conducting thermal shrinkable bushing coated with a layer of thermosol inside.Its external layer consists of radiation cross-linked polytheneand its internal layer is the specially designed adhesive internal wall.
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Heat Shrinkable Compound Double Wall Pipe
Heat shrinkable compound double wall pipe made of heat shrinkable insulation material and heat shrinkable semiconductive material by the way of special processing technology.Inner layer show good insulation performance,outer layer is of semi-conductive,inner and outer layers are clung closely,shielded reliably．
Learn More